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Press Releases 2005

2005


| Date | Subject
2005.12.14 JBlend™ Deployed in KDDI's A1405PT
2005.11.30 Aplix to Support NTT DoCoMo in Developing Next Generation Java™ Platform for Mobile Phones
2005.11.16 JBlend™ platform set to ship in the first commercial phone based on China Mobile's Java 3.0 specification
2005.11.09 Demonstration of JBlend™ with LinuxLink Service at Embedded Technology 2005
2005.11.08 JBlend™ powers All Six Models of FOMA™ 902i Series from NTT DoCoMo
2005.11.01 Aplix Announces Advanced Java™ Specifications Available for QUALCOMM's BREW® Solution
2005.10.20 WILLCOM new handheld device "W-ZERO3" uses JBlend™
2005.09.29 China Mobile Unveils its 3.0 Java Specification with Associated Toolkit (CETK)
2005.09.14 Aplix Joins Blu-ray Disc Association
Accelerate integration of Java™ platform in Blu-ray Disc devices
2005.09.13
 JBlend™ Deployed in Motorola's ROKR
2005.09.01
 Aplix to Provide JBlend™ Platform for Samsung E860v Mobile Phone
2005.08.04
 Aplix to offer tailored version of JBlend™ for ACCESS' NetFront®
2005.08.01
 Aplix Deploys JBlend™ in the First Commercial Handset using Intel's PXA 800F processor
2005.08.01
 Panasonic to Use JBlend™ for GSM phones overseas
2005.07.13
 JBlend™ Deployed in NTT DoCoMo’s FOMA™
SH901iS by SHARP
2005.06.16
 Aplix and TAT Form Strategic Partnership to Bring a More Compelling User Experience to Mobile Phones <view Demo>
2005.05.25
 MoPiD deployed in mobile phone by NEC
2005.05.09
 Aplix and Superscape Partner to Integrate Java and 3D Technology for Mobile Phones
2005.05.02
 Aplix and HI CORPORATION Close Cooperative Partnership to Integrate Java and 3D Technology
2005.04.27
 Aplix to license and distribute Hybrid’s embedded 3D graphics technology
2005.04.13
 Aplix to jointly develop the Doja/Java Platform for FOMA handsets with NTT DoCoMo
2005.03.22
 iaSolution awarded CETK Contract by China Mobile
2005.02.14
 Aplix's JBlend™ Technology Exceeds 92 Million Shipments in Mobile Phones and Consumer Electronics Devices
2005.02.14
 JBlend™ supports Texas Instruments' OMAP2420
Demonstration in TI Developer Village at 3GSM World Congress 2005

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